DRY FILM PHOTORESIST

Our LONGLITE® dry film photoresist is negative and water-soluble type with good resolution and adhesion. It is suitable for various processes, such as acid etching of fine lines, tenting, electroplating copper, and other PCB manufacturing processes.

Manufacturing of printing circuit board

Used in the PCB image transfer.

Ni-Au plating-resist or alkaline etching process

AF-5000.

Outer layer circuits and copper plating-resist

FF-9040S.

Acid etching process (PCB & flex-PCB)

FF-9100A.

Direct imaging

DI-2200A.

Transparent conductive membrane etching process (for touch panel)

TP-2000, FC-3000R.

Fine wiring (PCB & flex-PCB)

T-4800.